From f2418d7f5a9734590c4e0d3392886423b2e818a9 Mon Sep 17 00:00:00 2001 From: Nao Pross Date: Fri, 19 May 2017 16:14:00 +0200 Subject: finish wiring and add eurocard compliant standard holes since there wasn't enough space (I should have added the holes before beginning) there are only 4 holes instead of 6 (2 will be cut out since the space is unused). --- .../Design Rule Check - MainBoard.html | 522 +++++++++++++++++++++ 1 file changed, 522 insertions(+) create mode 100644 hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.html (limited to 'hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.html') diff --git a/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.html b/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.html new file mode 100644 index 0000000..83d725b --- /dev/null +++ b/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.html @@ -0,0 +1,522 @@ + + + +Design Rule Verification Report + +Altium

Design Rule Verification Report

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Date:19.05.2017
Time:14:30:28
Elapsed Time:00:00:02
Filename:F:\School\Lab3\projects\z80uPC\hw\MainBoard.PcbDoc
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Warnings:6
Rule Violations:40
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Summary

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WarningsCount
Zero hole size multi-layer pad(s) detected3
Multilayer Pads with 0 size Hole found3
Total6

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Rule ViolationsCount
Power Plane Connect Rule(NoConnect Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) ((ObjectKind = 'Pad') and (Name Like '*DEC*'))0
Net Antennae (Tolerance=0mil) (All)0
Silk to Silk (Clearance=7.874mil) (All),(All)2
Silk To Solder Mask (Clearance=7.874mil) (IsPad),(All)9
Minimum Solder Mask Sliver (Gap=3.15mil) (All),(All)0
Hole To Hole Clearance (Gap=13.78mil) (All),(All)0
Height Constraint (Min=0mil) (Max=984.252mil) (Prefered=492.126mil) (All)0
Pads and Vias to follow the Drill pairs settings0
Hole Size Constraint (Min=9.842mil) (Max=78.74mil) (All)7
Component Clearance Constraint ( Horizontal Gap = 9.842mil, Vertical Gap = 9.842mil ) (All),(All) 0
Minimum Annular Ring (Minimum=6.89mil) (((ObjectKind = 'Pad') OR (ObjectKind = 'Via')) And (Layer = 'MultiLayer') And (HoleDiameter <= AsMM(0.45)))0
Minimum Annular Ring (Minimum=6.89mil) (((ObjectKind = 'Pad') OR (ObjectKind = 'Via')) And (Layer = 'MultiLayer') And (HoleDiameter > AsMM(0.45)))0
Un-Routed Net Constraint ( (All) )4
Short-Circuit Constraint (Allowed=No) (All),(All)0
Power Plane Connect Rule(Relief Connect )(Expansion=6.89mil) (Conductor Width=7.874mil) (Air Gap=7.874mil) (Entries=4) (All)0
Width Constraint (Min=6mil) (Max=60mil) (Preferred=10mil) (All)0
Clearance Constraint (Gap=5.905mil) (All),(All)0
Modified Polygon (Allow modified: No), (Allow shelved: No)0
Board Clearance Constraint (Gap=0mil) (All)18
Total40

Warnings

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Zero hole size multi-layer pad(s) detected
Pad J2-2(215.276mil,6780.63mil) on Multi-Layer on Net DB9-5
Pad J2-1(459.37mil,6780.787mil) on Multi-Layer on Net NetC11_2
Pad J2-3(335mil,6580mil) on Multi-Layer on Net NetJ2_3
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Multilayer Pads with 0 size Hole found
Pad J2-2(215.276mil,6780.63mil) on Multi-Layer
Pad J2-1(459.37mil,6780.787mil) on Multi-Layer
Pad J2-3(335mil,6580mil) on Multi-Layer
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Silk to Silk (Clearance=7.874mil) (All),(All)
Silk To Silk Clearance Constraint: (1.733mil < 7.874mil) Between Text "16" (730mil,2490mil) on Top Overlay And Track (600mil,2500mil)(800mil,2500mil) on Top Overlay Silk Text to Silk Clearance [1.733mil]
Silk To Silk Clearance Constraint: (1.733mil < 7.874mil) Between Text "15" (630mil,2490mil) on Top Overlay And Track (600mil,2500mil)(800mil,2500mil) on Top Overlay Silk Text to Silk Clearance [1.733mil]
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Silk To Solder Mask (Clearance=7.874mil) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (6.537mil < 7.874mil) Between Track (420mil,6602.835mil)(494.803mil,6602.835mil) on Top Overlay And Pad J2-3(335mil,6580mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [6.537mil]
Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-5(2970mil,340mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-4(2970mil,420mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-3(2970mil,500mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-1(2970mil,660mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (1740mil,3810mil)(1780mil,3810mil) on Top Overlay And Pad R1-2(1700mil,3810mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (2020mil,3810mil)(2060mil,3810mil) on Top Overlay And Pad R1-1(2100mil,3810mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (1740mil,4000mil)(1780mil,4000mil) on Top Overlay And Pad R2-2(1700mil,4000mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (2020mil,4000mil)(2060mil,4000mil) on Top Overlay And Pad R2-1(2100mil,4000mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
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Hole Size Constraint (Min=9.842mil) (Max=78.74mil) (All)
Hole Size Constraint: (100mil > 78.74mil) Pad J2-3(335mil,6580mil) on Multi-Layer Actual Slot Hole Width = 100mil
Hole Size Constraint: (100mil > 78.74mil) Pad J2-1(459.37mil,6780.787mil) on Multi-Layer Actual Slot Hole Width = 100mil
Hole Size Constraint: (100mil > 78.74mil) Pad J2-2(215.276mil,6780.63mil) on Multi-Layer Actual Slot Hole Width = 100mil
Hole Size Constraint: (128.346mil > 78.74mil) Pad J1-10(334.016mil,3618.071mil) on Multi-Layer Actual Hole Size = 128.346mil
Hole Size Constraint: (128.346mil > 78.74mil) Pad J1-11(334.016mil,4601.929mil) on Multi-Layer Actual Hole Size = 128.346mil
Hole Size Constraint: (110.236mil > 78.74mil) Pad P6-33(6190.551mil,3718.504mil) on Multi-Layer Actual Hole Size = 110.236mil
Hole Size Constraint: (110.236mil > 78.74mil) Pad P6-34(6190.551mil,218.504mil) on Multi-Layer Actual Hole Size = 110.236mil
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Un-Routed Net Constraint ( (All) )
Un-Routed Net Constraint: Net NetC11_2 Between Pad J2-1(459.37mil,6780.787mil) on Multi-Layer And Pad C11-2(670mil,6880mil) on Multi-Layer
Un-Routed Net Constraint: Net NetC11_2 Between Pad C11-2(670mil,6880mil) on Multi-Layer And Pad U18-1(1310mil,6840mil) on Multi-Layer
Un-Routed Net Constraint: Net NetC6_1 Between Track (2000mil,4250mil)(2100mil,4150mil) on Solder Side And Pad Y1-2(2000mil,4550mil) on Multi-Layer
Un-Routed Net Constraint: Net NetC5_1 Between Pad U6-16(1700mil,3000mil) on Multi-Layer And Pad R2-2(1700mil,4000mil) on Multi-Layer
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Board Clearance Constraint (Gap=0mil) (All)
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-67.559mil,3733.622mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-248.858mil,3788.543mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-67.559mil,4486.378mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-248.858mil,4431.457mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-80mil,6957.166mil)(494.803mil,6957.166mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-80mil,6602.835mil)(-80mil,6957.166mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-80mil,6602.835mil)(246.772mil,6602.835mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-40mil,4716.299mil)(448.189mil,4716.299mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-40mil,3503.701mil)(448.189mil,3503.701mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-276.221mil,3788.543mil)(-276.221mil,4431.457mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-40mil,3503.701mil)(-40mil,4716.299mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-248.661mil,3760.984mil)(-67.559mil,3760.984mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-248.661mil,4459.016mil)(-67.559mil,4459.016mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (6588.189mil,118.11mil)(6588.189mil,3818.898mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (6229.921mil,118.11mil)(6588.189mil,118.11mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (6229.921mil,3818.898mil)(6588.189mil,3818.898mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Text "J2" (-74.52mil,7081.48mil) on Top Overlay And Board Edge
Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Text "J1" (-270.52mil,4750.48mil) on Top Overlay And Board Edge
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