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authorNao Pross <naopross@thearcway.org>2017-05-23 11:51:48 +0200
committerNao Pross <naopross@thearcway.org>2017-05-23 11:51:48 +0200
commita29b4fd588d6f3136bfef0d5dc1ee40ead328b15 (patch)
treea39f231b7025c754c9ee643dde6efd416db269ee /hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc
parentfinish wiring and add eurocard compliant standard holes (diff)
downloadz80uPC-a29b4fd588d6f3136bfef0d5dc1ee40ead328b15.tar.gz
z80uPC-a29b4fd588d6f3136bfef0d5dc1ee40ead328b15.zip
board complete, generate gerber (x2) fileshardware
this is probably the last commit before printing the PCB, unless there are some other errors in the board design
Diffstat (limited to 'hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc')
-rw-r--r--hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc145
1 files changed, 66 insertions, 79 deletions
diff --git a/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc b/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc
index 411cc1a..1b06010 100644
--- a/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc
+++ b/hw/Project Outputs for z80uPC/Design Rule Check - MainBoard.drc
@@ -1,115 +1,102 @@
Protel Design System Design Rule Check
PCB File : F:\School\Lab3\projects\z80uPC\hw\MainBoard.PcbDoc
-Date : 19.05.2017
-Time : 14:30:28
-
-WARNING: Zero hole size multi-layer pad(s) detected
- Pad J2-2(215.276mil,6780.63mil) on Multi-Layer on Net DB9-5
- Pad J2-1(459.37mil,6780.787mil) on Multi-Layer on Net NetC11_2
- Pad J2-3(335mil,6580mil) on Multi-Layer on Net NetJ2_3
+Date : 22.05.2017
+Time : 08:35:39
+
+Processing Rule : Board Clearance Constraint (Gap=0mm) (All)
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Arc (-6.321mm,112.559mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Arc (-1.716mm,113.954mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Arc (-6.321mm,96.229mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Arc (-1.716mm,94.834mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (158.24mm,97mm)(167.34mm,97mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (158.24mm,3mm)(167.34mm,3mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (167.34mm,3mm)(167.34mm,97mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-6.316mm,113.259mm)(-1.716mm,113.259mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-6.316mm,95.529mm)(-1.716mm,95.529mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-1.016mm,88.994mm)(-1.016mm,119.794mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-7.016mm,96.229mm)(-7.016mm,112.559mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-1.016mm,88.994mm)(11.384mm,88.994mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-1.016mm,119.794mm)(11.384mm,119.794mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-2.032mm,167.712mm)(6.268mm,167.712mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-2.032mm,167.712mm)(-2.032mm,176.712mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Track (-2.032mm,176.712mm)(12.568mm,176.712mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Text "J1" (-6.871mm,120.662mm) on Top Overlay And Board Edge
+ Violation between Board Outline Clearance(Outline Edge): (Collision < 0.25mm) Between Text "J2" (-1.893mm,179.872mm) on Top Overlay And Board Edge
+Rule Violations :18
-WARNING: Multilayer Pads with 0 size Hole found
- Pad J2-2(215.276mil,6780.63mil) on Multi-Layer
- Pad J2-1(459.37mil,6780.787mil) on Multi-Layer
- Pad J2-3(335mil,6580mil) on Multi-Layer
+Processing Rule : Modified Polygon (Allow modified: No), (Allow shelved: No)
+Rule Violations :0
-Processing Rule : Power Plane Connect Rule(NoConnect Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) ((ObjectKind = 'Pad') and (Name Like '*DEC*'))
+Processing Rule : Clearance Constraint (Gap=0.15mm) (All),(All)
Rule Violations :0
-Processing Rule : Net Antennae (Tolerance=0mil) (All)
+Processing Rule : Width Constraint (Min=0.152mm) (Max=1.524mm) (Preferred=0.254mm) (All)
Rule Violations :0
-Processing Rule : Silk to Silk (Clearance=7.874mil) (All),(All)
- Violation between Silk To Silk Clearance Constraint: (1.733mil < 7.874mil) Between Text "16" (730mil,2490mil) on Top Overlay And Track (600mil,2500mil)(800mil,2500mil) on Top Overlay Silk Text to Silk Clearance [1.733mil]
- Violation between Silk To Silk Clearance Constraint: (1.733mil < 7.874mil) Between Text "15" (630mil,2490mil) on Top Overlay And Track (600mil,2500mil)(800mil,2500mil) on Top Overlay Silk Text to Silk Clearance [1.733mil]
-Rule Violations :2
+Processing Rule : Power Plane Connect Rule(Relief Connect )(Expansion=0.175mm) (Conductor Width=0.2mm) (Air Gap=0.2mm) (Entries=4) (All)
+Rule Violations :0
-Processing Rule : Silk To Solder Mask (Clearance=7.874mil) (IsPad),(All)
- Violation between Silk To Solder Mask Clearance Constraint: (6.537mil < 7.874mil) Between Track (420mil,6602.835mil)(494.803mil,6602.835mil) on Top Overlay And Pad J2-3(335mil,6580mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [6.537mil]
- Violation between Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-5(2970mil,340mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
- Violation between Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-4(2970mil,420mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
- Violation between Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-3(2970mil,500mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
- Violation between Silk To Solder Mask Clearance Constraint: (4.907mil < 7.874mil) Between Track (3010mil,250mil)(3010mil,750mil) on Top Overlay And Pad S1-1(2970mil,660mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [4.907mil]
- Violation between Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (1740mil,3810mil)(1780mil,3810mil) on Top Overlay And Pad R1-2(1700mil,3810mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
- Violation between Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (2020mil,3810mil)(2060mil,3810mil) on Top Overlay And Pad R1-1(2100mil,3810mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
- Violation between Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (1740mil,4000mil)(1780mil,4000mil) on Top Overlay And Pad R2-2(1700mil,4000mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
- Violation between Silk To Solder Mask Clearance Constraint: (7.356mil < 7.874mil) Between Track (2020mil,4000mil)(2060mil,4000mil) on Top Overlay And Pad R2-1(2100mil,4000mil) on Multi-Layer [Top Overlay] to [Top Solder] clearance [7.356mil]
-Rule Violations :9
+Processing Rule : Short-Circuit Constraint (Allowed=No) (All),(All)
+Rule Violations :0
-Processing Rule : Minimum Solder Mask Sliver (Gap=3.15mil) (All),(All)
+Processing Rule : Un-Routed Net Constraint ( (All) )
Rule Violations :0
-Processing Rule : Hole To Hole Clearance (Gap=13.78mil) (All),(All)
+Processing Rule : Minimum Annular Ring (Minimum=0.175mm) (((ObjectKind = 'Pad') OR (ObjectKind = 'Via')) And (Layer = 'MultiLayer') And (HoleDiameter > AsMM(0.45)))
Rule Violations :0
-Processing Rule : Height Constraint (Min=0mil) (Max=984.252mil) (Prefered=492.126mil) (All)
+Processing Rule : Minimum Annular Ring (Minimum=0.175mm) (((ObjectKind = 'Pad') OR (ObjectKind = 'Via')) And (Layer = 'MultiLayer') And (HoleDiameter <= AsMM(0.45)))
Rule Violations :0
-Processing Rule : Pads and Vias to follow the Drill pairs settings
+Processing Rule : Component Clearance Constraint ( Horizontal Gap = 0.25mm, Vertical Gap = 0.25mm ) (All),(All)
Rule Violations :0
-Processing Rule : Hole Size Constraint (Min=9.842mil) (Max=78.74mil) (All)
- Violation between Hole Size Constraint: (100mil > 78.74mil) Pad J2-3(335mil,6580mil) on Multi-Layer Actual Slot Hole Width = 100mil
- Violation between Hole Size Constraint: (100mil > 78.74mil) Pad J2-1(459.37mil,6780.787mil) on Multi-Layer Actual Slot Hole Width = 100mil
- Violation between Hole Size Constraint: (100mil > 78.74mil) Pad J2-2(215.276mil,6780.63mil) on Multi-Layer Actual Slot Hole Width = 100mil
- Violation between Hole Size Constraint: (128.346mil > 78.74mil) Pad J1-10(334.016mil,3618.071mil) on Multi-Layer Actual Hole Size = 128.346mil
- Violation between Hole Size Constraint: (128.346mil > 78.74mil) Pad J1-11(334.016mil,4601.929mil) on Multi-Layer Actual Hole Size = 128.346mil
- Violation between Hole Size Constraint: (110.236mil > 78.74mil) Pad P6-33(6190.551mil,3718.504mil) on Multi-Layer Actual Hole Size = 110.236mil
- Violation between Hole Size Constraint: (110.236mil > 78.74mil) Pad P6-34(6190.551mil,218.504mil) on Multi-Layer Actual Hole Size = 110.236mil
-Rule Violations :7
+Processing Rule : Hole Size Constraint (Min=0.25mm) (Max=2mm) (All)
+ Violation between Hole Size Constraint: (2.8mm > 2mm) Pad P6-34(157.24mm,5.55mm) on Multi-Layer Actual Hole Size = 2.8mm
+ Violation between Hole Size Constraint: (2.8mm > 2mm) Pad P6-33(157.24mm,94.45mm) on Multi-Layer Actual Hole Size = 2.8mm
+ Violation between Hole Size Constraint: (3.26mm > 2mm) Pad J1-11(8.484mm,116.889mm) on Multi-Layer Actual Hole Size = 3.26mm
+ Violation between Hole Size Constraint: (3.26mm > 2mm) Pad J1-10(8.484mm,91.899mm) on Multi-Layer Actual Hole Size = 3.26mm
+ Violation between Hole Size Constraint: (2.8mm > 2mm) Pad Free-BL(3.6mm,5.55mm) on Multi-Layer Actual Hole Size = 2.8mm
+ Violation between Hole Size Constraint: (2.8mm > 2mm) Pad Free-TR(157.24mm,138.9mm) on Multi-Layer Actual Hole Size = 2.8mm
+ Violation between Hole Size Constraint: (2.8mm > 2mm) Pad Free-TL(3.6mm,138.9mm) on Multi-Layer Actual Hole Size = 2.8mm
+ Violation between Hole Size Constraint: (2.54mm > 2mm) Pad J2-2(5.468mm,172.228mm) on Multi-Layer Actual Slot Hole Width = 2.54mm
+ Violation between Hole Size Constraint: (2.54mm > 2mm) Pad J2-1(11.668mm,172.232mm) on Multi-Layer Actual Slot Hole Width = 2.54mm
+ Violation between Hole Size Constraint: (2.54mm > 2mm) Pad J2-3(8.509mm,167.132mm) on Multi-Layer Actual Slot Hole Width = 2.54mm
+Rule Violations :10
-Processing Rule : Component Clearance Constraint ( Horizontal Gap = 9.842mil, Vertical Gap = 9.842mil ) (All),(All)
+Processing Rule : Pads and Vias to follow the Drill pairs settings
Rule Violations :0
-Processing Rule : Minimum Annular Ring (Minimum=6.89mil) (((ObjectKind = 'Pad') OR (ObjectKind = 'Via')) And (Layer = 'MultiLayer') And (HoleDiameter <= AsMM(0.45)))
+Processing Rule : Height Constraint (Min=0mm) (Max=25mm) (Prefered=12.5mm) (All)
Rule Violations :0
-Processing Rule : Minimum Annular Ring (Minimum=6.89mil) (((ObjectKind = 'Pad') OR (ObjectKind = 'Via')) And (Layer = 'MultiLayer') And (HoleDiameter > AsMM(0.45)))
+Processing Rule : Hole To Hole Clearance (Gap=0.35mm) (All),(All)
Rule Violations :0
-Processing Rule : Un-Routed Net Constraint ( (All) )
- Violation between Un-Routed Net Constraint: Net NetC11_2 Between Pad J2-1(459.37mil,6780.787mil) on Multi-Layer And Pad C11-2(670mil,6880mil) on Multi-Layer
- Violation between Un-Routed Net Constraint: Net NetC11_2 Between Pad C11-2(670mil,6880mil) on Multi-Layer And Pad U18-1(1310mil,6840mil) on Multi-Layer
- Violation between Un-Routed Net Constraint: Net NetC6_1 Between Track (2000mil,4250mil)(2100mil,4150mil) on Solder Side And Pad Y1-2(2000mil,4550mil) on Multi-Layer
- Violation between Un-Routed Net Constraint: Net NetC5_1 Between Pad U6-16(1700mil,3000mil) on Multi-Layer And Pad R2-2(1700mil,4000mil) on Multi-Layer
-Rule Violations :4
-
-Processing Rule : Short-Circuit Constraint (Allowed=No) (All),(All)
+Processing Rule : Minimum Solder Mask Sliver (Gap=0.08mm) (All),(All)
Rule Violations :0
-Processing Rule : Power Plane Connect Rule(Relief Connect )(Expansion=6.89mil) (Conductor Width=7.874mil) (Air Gap=7.874mil) (Entries=4) (All)
-Rule Violations :0
+Processing Rule : Silk To Solder Mask (Clearance=0.2mm) (IsPad),(All)
+ Violation between Silk To Solder Mask Clearance Constraint: (0.187mm < 0.2mm) Between Track (51.308mm,101.6mm)(52.324mm,101.6mm) on Top Overlay And Pad R2-1(53.34mm,101.6mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.187mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.187mm < 0.2mm) Between Track (44.196mm,101.6mm)(45.212mm,101.6mm) on Top Overlay And Pad R2-2(43.18mm,101.6mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.187mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.187mm < 0.2mm) Between Track (51.308mm,96.774mm)(52.324mm,96.774mm) on Top Overlay And Pad R1-1(53.34mm,96.774mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.187mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.187mm < 0.2mm) Between Track (44.196mm,96.774mm)(45.212mm,96.774mm) on Top Overlay And Pad R1-2(43.18mm,96.774mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.187mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.125mm < 0.2mm) Between Track (76.454mm,6.35mm)(76.454mm,19.05mm) on Top Overlay And Pad S1-1(75.438mm,16.764mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.125mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.125mm < 0.2mm) Between Track (76.454mm,6.35mm)(76.454mm,19.05mm) on Top Overlay And Pad S1-3(75.438mm,12.7mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.125mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.125mm < 0.2mm) Between Track (76.454mm,6.35mm)(76.454mm,19.05mm) on Top Overlay And Pad S1-4(75.438mm,10.668mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.125mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (0.125mm < 0.2mm) Between Track (76.454mm,6.35mm)(76.454mm,19.05mm) on Top Overlay And Pad S1-5(75.438mm,8.636mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0.125mm]
+ Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.2mm) Between Text "C3" (3.848mm,135.343mm) on Top Overlay And Pad Free-TL(3.6mm,138.9mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0mm]
+Rule Violations :9
-Processing Rule : Width Constraint (Min=6mil) (Max=60mil) (Preferred=10mil) (All)
+Processing Rule : Silk to Silk (Clearance=0.2mm) (All),(All)
Rule Violations :0
-Processing Rule : Clearance Constraint (Gap=5.905mil) (All),(All)
+Processing Rule : Net Antennae (Tolerance=0mm) (All)
Rule Violations :0
-Processing Rule : Modified Polygon (Allow modified: No), (Allow shelved: No)
+Processing Rule : Power Plane Connect Rule(NoConnect Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) ((ObjectKind = 'Pad') and (Name Like '*DEC*'))
Rule Violations :0
-Processing Rule : Board Clearance Constraint (Gap=0mil) (All)
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-67.559mil,3733.622mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-248.858mil,3788.543mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-67.559mil,4486.378mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Arc (-248.858mil,4431.457mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-80mil,6957.166mil)(494.803mil,6957.166mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-80mil,6602.835mil)(-80mil,6957.166mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-80mil,6602.835mil)(246.772mil,6602.835mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-40mil,4716.299mil)(448.189mil,4716.299mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-40mil,3503.701mil)(448.189mil,3503.701mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-276.221mil,3788.543mil)(-276.221mil,4431.457mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-40mil,3503.701mil)(-40mil,4716.299mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-248.661mil,3760.984mil)(-67.559mil,3760.984mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (-248.661mil,4459.016mil)(-67.559mil,4459.016mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (6588.189mil,118.11mil)(6588.189mil,3818.898mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (6229.921mil,118.11mil)(6588.189mil,118.11mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Track (6229.921mil,3818.898mil)(6588.189mil,3818.898mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Text "J2" (-74.52mil,7081.48mil) on Top Overlay And Board Edge
- Violation between Board Outline Clearance(Outline Edge): (Collision < 9.842mil) Between Text "J1" (-270.52mil,4750.48mil) on Top Overlay And Board Edge
-Rule Violations :18
-
-Violations Detected : 40
+Violations Detected : 37
Time Elapsed : 00:00:02 \ No newline at end of file